• Repetition: Baseband Transmission
  • Pulse shaping: Non-return to zero (NRZ) rectangular pulses, raised-cosine pulses, square-root raised-cosine pulses
  • Power spectral density (psd) of baseband signals
  • Intersymbol interference (ISI)
  • First and second Nyquist criterion
  • AWGN channel
  • Matched filter
  • Matched-filter receiver and correlation receiver
  • Noise whitening matched filter
  • Discrete-time AWGN channel model
• Representation of bandpass signals and systems in the equivalent baseband
  • Quadrature amplitude modulation (QAM)
  • Equivalent baseband signal and system
  • Analytical signal
  • Equivalent baseband random process, equivalent baseband white Gaussian noise process
  • Equivalent baseband AWGN channel
  • Equivalent baseband channel model with frequency-offset and phase noise
  • Equivalent baseband Rayleigh fading and Rice fading channel models
  • Equivalent baseband frequency-selective channel model
  • Discrete memoryless channels (DMC)
• Bandpass transmission via carrier modulation
  • Amplitude modulation, frequency modulation, phase modulation
  • Linear digital modulation methods
    • On-off keying, M-ary amplitude shift keying (M-ASK), M-ary phase shift keying (M-PSK), M-ary quadrature amplitude modulation (M-QAM), offset-QPSK
    • Signal space representation of transmit signal constellations and signals
    • Energy of linear digital modulated signals, average energy per symbol
    • Power spectral density of linear digital modulated signals
    • Bandwidth efficiency
    • Correlation coefficient of elementary signals
    • Error probabilities of linear digital modulation methods
      • Error functions
      • Gray mapping and natural mapping
      • Bit error probabilities, symbol error probabilities, pairwise symbol error probabilities
      • Euclidean distance and Hamming distance
      • Exact and approximate computation of error probabilities
      • Performance comparison of modulation schemes in terms of per bit SNR vs. per symbol SNR
    • Hierarchical modulation, multilevel modulation
    • Effects of carrier phase offset and carrier frequency offset
    • Differential modulation
      • M-ary differential phase shift keying (M-PSK)
      • Coherent and non-coherent detection of DPSK
      • p/M-differential phase shift keying (p/M-DPSK)
      • Differential amplitude and phase shift keying (DAPSK)
  • Non-linear digital modulation methods
    • Frequency shift keying (FSK)
    • Modulation index
    • Minimum shift keying (MSK)
      • Offset-QPSK representation of MSK
      • MSK with differential precoding and rotation
      • Bit error probabilities of MSK
      • Gaussian minimum shift keying (GMSK)
      • Power spectral density of MSK and GMSK
    • Continuous phase modulation (CPM)
      • General description of CPM signals
      • Frequency pulses and phase pulses
    • Coherent and non-coherent detection of FSK
  • Performance comparison of linear and non-linear digital modulation methods
• Frequency-selective channels, ISI channels
  • Intersymbol interference and frequency-selectivity
  • RMS delay spread
  • Narrowband and broadband channels
  • Equivalent baseband transmission model for frequency-selective channels
  • Receive filter design
• Equalization
  • Symbol-spaced and fractionally-spaced equalizers
  • Inverse system
  • Non-recursive linear equalizers
    • Linear zero-forcing (ZF) equalizer
    • Linear minimum mean squared error (MMSE) equalizer
  • Non-linear equalization:
    • Decision feedback equalizer (DFE)
    • Tomlinson-Harashima precoding
  • Maximum a posteriori probability (MAP) and maximum likelihood equalizer, Viterbi algorithm
• Single-carrier vs. multi-carrier transmission
• Multi-carrier transmission
  • General multicarrier transmission
  • Orthogonal frequency division multiplex (OFDM)
    • OFDM implementation using the Fast Fourier Transform (FFT)
    • Cyclic guard interval
    • Power spectral density of OFDM
    • Peak-to-average power ratio (PAPR)
• Multiple access
  • Principles of time division multiple access (TDMA), frequency division multiple access (FDMA), code division multiple access (CDMA), non-orthogonal multiple access (NOMA), hybrid multiple access
• Spread spectrum communications
  • Direct sequence spread spectrum communications
  • Frequency hopping
  • Protection against eavesdropping
  • Protection against narrowband jammers
  • Short vs. long spreading codes
  • Direct sequence spread spectrum communications in frequency-selective channels
    • Rake receiver
  • Code division multiple access (CDMA)
    • Design criteria of spreading sequences, autocorrelation function and crosscorrelation function of spreading sequences
    • Intersymbol interference (ISI) and multiple access interference (MAI)
    • Pseudo noise (PN) sequences, maximum length sequences (m-sequences), Gold codes, Walsh-Hadamard codes, orthogonal variable spreading factor (OVSF) codes
    • Multicode transmission   
    • CDMA in uplink and downlink of a wireless communications system
    • Single-user detection vs. multi-user detection

K. Kammeyer: Nachrichtenübertragung, Teubner

P.A. Höher: Grundlagen der digitalen Informationsübertragung, Teubner.

J.G. Proakis, M. Salehi: Digital Communications. McGraw-Hill.

S. Haykin: Communication Systems. Wiley

R.G. Gallager: Principles of Digital Communication. Cambridge

A. Goldsmith: Wireless Communication. Cambridge.

D. Tse, P. Viswanath: Fundamentals of Wireless Communication. Cambridge.

- DSL-Übertragung

- Stochastische Prozesse

- Digitale Datenübertragung

K. Kammeyer: Nachrichtenübertragung, Teubner

P.A. Höher: Grundlagen der digitalen Informationsübertragung, Teubner.

J.G. Proakis, M. Salehi: Digital Communications. McGraw-Hill.

S. Haykin: Communication Systems. Wiley

R.G. Gallager: Principles of Digital Communication. Cambridge

A. Goldsmith: Wireless Communication. Cambridge.

D. Tse, P. Viswanath: Fundamentals of Wireless Communication. Cambridge.

• Electron transport in semiconductors
• Electronic operating principles of diodes, MOS capacitors, and MOS field-effect transistors
• MOS transistor as four terminal device
• Performace degradation due to short channel effects
• Scaling-down of MOS technology
• Digital logic circuits
• Basic analog circuits
  
• Operational amplifiers
• Bipolar and BiCMOS circuits
  
  

• Yuan Taur, Tak H. Ning:  Fundamentals of Modern VLSI Devices, Cambridge University Press 1998
• R. Jacob Baker: CMOS, Circuit Design, Layout and Simulation,  IEEE Press, Wiley Interscience, 3rd Edition, 2010
• Neil H.E. Weste and David Money Harris, Integrated Circuit Design, Pearson, 4th International Edition, 2013
  
• John E. Ayers, Digital Integrated Circuits: Analysis and Design, CRC Press, 2009
  
• Richard C. Jaeger and Travis N. Blalock: Microelectronic Circuit Design, Mc Graw-Hill, 4rd. Edition, 2010
  
  

Object and goal of MEMS

Scaling Rules

Lithography

Film deposition

Structuring and etching

Energy conversion and force generation

Electromagnetic Actuators

Reluctance motors

Piezoelectric actuators, bi-metal-actuator

Transducer principles

Signal detection and signal processing

Mechanical and physical sensors

Acceleration sensor, pressure sensor

Sensor arrays

System integration

Yield, test and reliability

M. Kasper: Mikrosystementwurf, Springer (2000)

M. Madou: Fundamentals of Microfabrication, CRC Press (1997)

Examples of MEMS components

Layout consideration

Electric, thermal and mechanical behaviour

Design aspects

Wird in der Veranstaltung bekannt gegeben

• Introduction (historical view, scientific and economic relevance, scaling laws)
• Semiconductor Technology Basics, Lithography (wafer fabrication, photolithography, improving resolution, next-generation lithography, nano-imprinting, molecular imprinting)
• Deposition Techniques (thermal oxidation, epitaxy, electroplating, PVD techniques: evaporation and sputtering; CVD techniques: APCVD, LPCVD, PECVD and LECVD; screen printing)
• Etching and Bulk Micromachining (definitions, wet chemical etching, isotropic etch with HNA, electrochemical etching, anisotropic etching with KOH/TMAH: theory, corner undercutting, measures for compensation and etch-stop techniques; plasma processes, dry etching: back sputtering, plasma etching, RIE, Bosch process, cryo process, XeF2 etching)
• Surface Micromachining and alternative Techniques (sacrificial etching, film stress, stiction: theory and counter measures; Origami microstructures, Epi-Poly, porous silicon, SOI, SCREAM process, LIGA, SU8, rapid prototyping)
• Thermal and Radiation Sensors (temperature measurement, self-generating sensors: Seebeck effect and thermopile; modulating sensors: thermo resistor, Pt-100, spreading resistance sensor, pn junction, NTC and PTC; thermal anemometer, mass flow sensor, photometry, radiometry, IR sensor: thermopile and bolometer)
• Mechanical Sensors (strain based and stress based principle, capacitive readout, piezoresistivity,  pressure sensor: piezoresistive, capacitive and fabrication process; accelerometer: piezoresistive, piezoelectric and capacitive; angular rate sensor: operating principle and fabrication process)
• Magnetic Sensors (galvanomagnetic sensors: spinning current Hall sensor and magneto-transistor; magnetoresistive sensors: magneto resistance, AMR and GMR, fluxgate magnetometer)
• Chemical and Bio Sensors (thermal gas sensors: pellistor and thermal conductivity sensor; metal oxide semiconductor gas sensor, organic semiconductor gas sensor, Lambda probe, MOSFET gas sensor, pH-FET, SAW sensor, principle of biosensor, Clark electrode, enzyme electrode, DNA chip)
• Micro Actuators, Microfluidics and TAS (drives: thermal, electrostatic, piezo electric and electromagnetic; light modulators, DMD, adaptive optics, microscanner, microvalves: passive and active, micropumps, valveless micropump, electrokinetic micropumps, micromixer, filter, inkjet printhead, microdispenser, microfluidic switching elements, microreactor, lab-on-a-chip, microanalytics)
• MEMS in medical Engineering (wireless energy and data transmission, smart pill, implantable drug delivery system, stimulators: microelectrodes, cochlear and retinal implant; implantable pressure sensors, intelligent osteosynthesis, implant for spinal cord regeneration)
• Design, Simulation, Test (development and design flows, bottom-up approach, top-down approach, testability, modelling: multiphysics, FEM and equivalent circuit simulation; reliability test, physics-of-failure, Arrhenius equation, bath-tub relationship)
• System Integration (monolithic and hybrid integration, assembly and packaging, dicing, electrical contact: wire bonding, TAB and flip chip bonding; packages, chip-on-board, wafer-level-package, 3D integration, wafer bonding: anodic bonding and silicon fusion bonding; micro electroplating, 3D-MID)

M. Madou: Fundamentals of Microfabrication, CRC Press, 2002

N. Schwesinger: Lehrbuch Mikrosystemtechnik, Oldenbourg Verlag, 2009

T. M. Adams, R. A. Layton:Introductory MEMS, Springer, 2010

G. Gerlach; W. Dötzel: Introduction to microsystem technology, Wiley, 2008

Finite difference methods

Approximation error

Finite element method

Order of convergence

Error estimation, mesh refinement

Makromodeling

Reduced order modeling

Black-box models

System identification

Multi-physics systems

System simulation

Levels of simulation, network simulation

Transient problems

Non-linear problems

Introduction to Comsol

Application to thermal, electric, electromagnetic, mechanical and fluidic problems

M. Kasper: Mikrosystementwurf, Springer (2000)

S. Senturia: Microsystem Design, Kluwer (2001)

• Circuit-Simulator SPICE 
• SPICE-Models for MOS transistors
• IC design
• Technology of MOS circuits
• Standard cell design
• Design of gate arrays
• CMOS transconductance and transimpedance amplifiers
• frequency behavior of CMOS circuits
  
• Techniques for improved circuit behaviour (e.g. cascodes, gain boosting, folding, ...)
• Examples for realization of ASICs in the institute of nanoelectronics
• Reliability of integrated circuits
• Testing of integrated circuits

R. J. Baker, „CMOS-Circuit Design, Layout, and Simulation“, Wiley & Sons, IEEE Press, 2010 

B. Razavi,"Design of Analog CMOS Integrated Circuits", McGraw-Hill Education Ltd, 2000

X. Liu, VLSI-Design Methodology Demystified; IEEE, 2009

• Einführung (historische Betrachtung und Trends in der Mikroelektronik)
• Werkstoffgrundlagen (Halbleiter, Kristalle, Miller-Indizes, Kristallfehler)
• Kristallherstellung (Kristallzucht für Si und GaAs: Verunreinigungen, Reinigung, Czochralski-, Bridgeman- und Zonenschmelz-Verfahren)
• Waferherstellung (Prozessabfolge, Parameter, SOI)
• Prozessgrundlagen

• Dotierung (Bändermodell, Dotierung, Dotierung durch Legieren, Dotierung durch Diffusion: Transportprozesse, Dotierungsprofile, Effekte höherer Ordnung und Prozesstechnik, Ionenimplantation: Theorie, Implantationsprofile, Channeling, Implantationsschäden, Ausheilprozesse und Anlagentechnik)

• Oxidation (Siliziumdioxid: Struktur, elektrische Eigenschaften und Ladungen im Oxid, thermische Oxidation: Reaktionen, Kinetik, Einflüsse auf Wachstumsrate und Prozess- und Anlagentechnik, anodische Oxidation, Plasmaoxidation, thermische Oxidation von GaAs)

• Abscheideverfahren (Theorie: Keimbildung, Schichtwachstum und Strukturzonenmodell, Wachstumsprozess, Reaktionskinetik, Temperatureinfluss und Reaktorbau; Epitaxie: Gasphasen-, Flüssigphasen-, Molekularstrahl-Epitaxie; CVD-Verfahren: APCVD, LPCVD, Abscheidung von Metallsiliziden, PECVD und LECVD; Grundlagen des Plasma, Anlagentechnik, PVD-Verfahren: Hochvakuum-Aufdampfen, Kathodenzerstäuben)

• Strukturierungsverfahren (subtraktive Verfahren, Photolithographie: Lackeigenschaften, Belichtungsverfahren, Kontakt-, Abstand- und Projektionsbelichtung, Auflösungsgrenze, Probleme in der Praxis und Belichtungseinrichtungen, additive Verfahren: Abhebetechnik und galvanische Abscheidung, Auflösungsverbesserung: Excimerlaser-Lichtquelle, Immersions- und Phasenkontrast-Lithographie, Elektronenstrahl-Lithographie, Röntgen-Lithographie, EUV-Lithographie, Ionenstrahl-Lithographie, nasschemisches Ätzen: isotrop und anisotrop, Eckenunterätzung, Kompensationsmasken und Ätzstoppverfahren; Trockenätzen: plasmaunterstütztes Ätzen, Rücksputtern, Ionenätzen, chemisches Trockenätzen, RIE, Seitenwandpassivierung)

• Prozess-Integration (CMOS-Prozess, Bipolar-Prozess)
• Aufbau- und Verbindungstechnik (Integrationshierarchien, Gehäuse, Chip-on-Board, Chip-Montagetechnik, Verbindungstechniken: Drahtbonden, TAB und Flipchip-Technik, Waferlevel-Package, 3D-Stacking)

S.K. Ghandi: VLSI Fabrication principles - Silicon and Gallium Arsenide, John Wiley & Sons

S.M. Sze: Semiconductor Devices - Physics and Technology, John Wiley & Sons

U. Hilleringmann: Silizium-Halbleitertechnologie, Teubner Verlag

H. Beneking: Halbleitertechnologie - Eine Einführung in die Prozeßtechnik von Silizium und III-V-Verbindungen, Teubner Verlag

K. Schade: Mikroelektroniktechnologie, Verlag Technik Berlin

S. Campbell: The Science and Engineering of Microelectronic Fabrication, Oxford University Press

P. van Zant: Microchip Fabrication - A Practical Guide to Semiconductor Processing, McGraw-Hill

Prepare, present, and discuss talks about recent topics from the field of semiconductors. The presentations must be given in English.

Evaluation Criteria:

• understanding of subject, discussion, response to questions
• structure and logic of presentation (clarity, precision)
• coverage of the topic, selection of subjects presented
• linguistic presentation (clarity, comprehensibility)
• visual presentation (clarity, comprehensibility)
• handout (see below)
• compliance with timing requirement.

Handout:
A printed handout (short abstract) of your presentation in English language is mandatory. This should not be longer than two pages A4, and include the most important results,
conclusions, explanations and diagrams.

Aktuelle Veröffentlichungen zu dem gewählten Thema.

Recent publications of the selected topics.

• see lecture

• Skript des Instituts für Kommunikationsnetze
• Tannenbaum, Computernetzwerke, Pearson-Studium

Further literature is announced at the beginning of the lecture.

• announced during lecture

- Antennen: Berechnungsgrundlagen - Kenngrößen - Verschiedene Antennenformen

- Funkwellenausbreitung

- Sender: Leistungserzeugung mit Röhren - Sendeverstärker

- Empfänger: Vorverstärker - Überlagerungsempfang - Empfangsempfindlichkeit - Rauschen

- Ausgewählte Systembeispiele

H.-G. Unger, „Elektromagnetische Theorie für die Hochfrequenztechnik, Teil I“, Hüthig, Heidelberg, 1988

H.-G. Unger, „Hochfrequenztechnik in Funk und Radar“, Teubner, Stuttgart, 1994

E. Voges, „Hochfrequenztechnik - Teil II: Leistungsröhren, Antennen und Funkübertragung, Funk- und Radartechnik“, Hüthig, Heidelberg, 1991

E. Voges, „Hochfrequenztechnik“, Hüthig, Bonn, 2004

C.A. Balanis, “Antenna Theory”, John Wiley and Sons, 1982

R. E. Collin, “Foundations for Microwave Engineering”, McGraw-Hill, 1992

D. M. Pozar, “Microwave and RF Design of Wireless Systems”, John Wiley and Sons, 2001

D. M. Pozar, “Microwave Engineerin”, John Wiley and Sons, 2005

The lecture deals with technical principles and related concepts of mobile communications. In this context, the main focus is put on the physical and data link layer of the ISO-OSI stack.

In the lecture, the transmission medium, i.e., the mobile radio channel, serves as the starting point of all considerations. The characteristics and the mathematical descriptions of the radio channel are discussed in detail. Subsequently, various physical layer aspects of wireless transmission are covered, such as channel coding, modulation/demodulation, channel estimation, synchronization, and equalization. Moreover, the different uses of multiple antennas at the transmitter and receiver, known as MIMO techniques, are described. Besides these physical layer topics, concepts of multiple access schemes in a cellular network are outlined.

In order to illustrate the above-mentioned technical solutions, the lecture will also provide a system view, highlighting the basics of some contemporary wireless systems, including LTE, LTE Advanced, and 5G New Radio.

John G. Proakis, Masoud Salehi: Digital Communications. 5th Edition, Irwin/McGraw Hill, 2007

David Tse, Pramod Viswanath: Fundamentals of Wireless Communication. Cambridge, 2005

Bernard Sklar: Digital Communications: Fundamentals and Applications. Second Edition, Pearson, 2013

Stefani Sesia, Issam Toufik, Matthew Baker: LTE - The UMTS Long Term Evolution. Second Edition, Wiley, 2011

Erik Dahlman, Stefan Parkvall, Johan Sköld: 5G NR - The Next Generation Wireless Access Technology. Second Edition, Academic Press, 2021

• Information extraction from communication signals
  • Time-of-arrival principle
    • Ranging in additive white Gaussian noise (AWGN) channel
    • Correlation-based range estimation
    • Effect of multipath propagation on time-of-arrival principle
    • Zero-forcing range estimation in the presence of multipath
    • Optimum range estimation in the presence of multipath
    • Zero-forcing in presence of noise
  • Angle-of-arrival principle
    • Angle-of-arrival estimation in AWGN channel
    • Delay-and-sum estimator
    • Multiple Signal Classifier (MUSIC)
    • MUSIC-based angle-of-arrival estimation
    • Case study: Comparison of estimators in AWGN channels
    • Effect of multipath propagation on angle-of-arrival principle
    • Case study: Comparison of estimators in multipath channels
• Information fusion of extracted signals 
  • Distance-based positioning
    • Principle of time-of-arrival positioning
    • Geometric interpretation
    • Positioning in the absence of noise
    • Linearization of the positioning problem
    • Positioning in the presence of noise
    • Optimality criteria
    • Least squares time-of-arrival positioning
    • Maximum likelihood time-of-arrival positioning
    • Interactive Matlab demo
    • Excursion: gradient descent solvers for nonlinear programs
    • Real-life positioning with embedded development board (Arduino)
    • Linearized least squares time-of-arrival positioning
    • Effect of clock offsets on distance-based positioning
    • Time-difference-of-arrival principle
    • Least squares time-difference-of-arrival positioning
    • Clock offset mitigation via two-way ranging
  • Performance limits of distance-based positioning
    • Fisher information and the Cramér-Rao lower bound
    • Fisher information in the AWGN case
    • Multi-variate Fisher information
    • Cramér-Rao lower bound for synchronized time-of-arrival positioning
    • Case study: Synchronized time-of-arrival positioning
    • Cramér-Rao lower bound for unsynchronized time-of-arrival positioning
    • Case study: Unsynchronized time-of-arrival positioning
  • Angle-based Positioning
    • Angle-of-arrival positioning principle
    • Geometric interpretation angle-of-arrival positioning principle
    • Noise-free angle-of-arrival positioning with known orientation
    • Effect of noise on angle-of-arrival positioning
    • Least squares angle-of-arrival positioning with known orientation
    • Linear least squares angle-of-arrival positioning
    • Effect of orientation uncertainty
    • Angle-difference-of-arrival positioning
    • Geometric interpretation angle difference of arrival positioning
    • Proof of angle-difference-of-arrival locus
    • Inscribed angle lemma
    • Case study: Angle-difference-of-arrival-positioning
  • Performance limits of angle-based positioning
    • Cramér-Rao lower bound for angle-of-arrival positioning with known orientation
    • Case study: Angle-of-arrival positioning with known orientation
• Information Filtering
  • Bayesian filtering
    • Principle of Bayesian filtering
    • General Problem Formulation
    • Solution to the linear Gaussian case
    • State transition in the linear Gaussian case
    • Proof of predicted posterior distribution of the Kalman filter
    • State update in the linear Gaussian case
    • Proof of marginal posterior distribution of the Kalman filter
    • Working with Gaussian random variables
      • Proof: Affine transformation
      • Proof: Marginalization
      • Proof: Conditioning
    • Kalman filter: Optimum Inference in the linear Gaussian case
    • Modeling of process noise
    • Modeling of measurement noise
    • Case study: Kalman filtering in the linear Gaussian case
    • Interactive Kalman filtering in Matlab
    • Dealing with nonlinearities in Bayesian filtering
    • Nonlinear Gaussian case
    • Extended Kalman filter
    • Proof of predicted posterior distribution of the extended Kalman filter
    • Proof of marginal posterior distribution of the extended Kalman filter
    • Example: Nonlinear state transition
    • Case study: Extended Kalman filtering
    • Practical considerations for filter design

• Satellite Navigation
  • Overview from positioning perspective
    • Earth-centered earth-fixed (ECEF) coordinate system
    • World geodetic system (WGS)
    • Satellite navigation systems
    • System-receiver clock offsets and pseudo-ranges
    • Unsynchronized time-of-arrival positioning revisited
  • GPS legacy signals and ranging
    • Signal overview
    • Time-of-arrival principle revisited
    • Direct sequence spread spectrum principle
    • Short and long codes
    • Satellite signal generation
    • Carriers and codes
    • Correlation properties of codes
    • Code division multiple access in flat fading channels
    • Navigation message
  • Velocity estimation
  • Hands-on case study: Design of an extended Kalman filter for satellite navigation based on recorded data

• Robust navigation
  • Multipath-assisted positioning in millimeter wave multiple antenna systems
  • Multi-sensor fusion 

• Introduction to satellite communications
  • What is a satellite
  • Overview orbits, Van Allen Belt, components of a satellite
  • Satellite services
  • Frequency bands for satellite services
  • International Telecommunications Union (ITU)
  • Influence of atmospheric impairments
  • Milestones in satellite communications
• Components of a satellite communications system
  • Ground segment
  • Space segment
  • Control segment
• Communication links
  • Uplink, downlink
  • Forward link, reverse link
  • Intersatellite links
  • Multiple access
  • Performance measures
    • Effective isotropic radiated power (EIRP), antenna gain, figure of merit, G/T, carrier to noise ratio
    • Signal to noise power ratio vs. carrier to noise ratio
• Single beam and multibeam satellites
  • Beam coverage
  • Examples for beam coverage of LEO and GEO satellites (Iridium, Viasat)
• Transparent vs. regenerative payload

• Orbits
  • Low earth orbot (LEO), medium earth orbit (MEO), geosynchroneous and geostationary orbits (GEO), highly elliptical orbits (HEO
  • Favourable orbits:
    • HEO orbits with 63-64^o inclination, Molnya and Tundra orbits
    • Circular LEO orbits
    • Circular MEO Orbits (Intermediate Circular Orbits (ICO))
    • Equatorial orbits, geostationary orbit (GEO)
  • Important aspects of LEO, MEO and GEO satellites
• Kepler’s laws of planetary motion
• Gravitational force
• Parameters of ellipses and elliptical orbits
  • Major and minor half axis
  • Foci
  • Eccentricity
  • Eccentric anomaly, mean anomaly, true anomaly
  • Area
  • Orbit period
  • Perigee, apogee
  • Distance of satellite from center of earth
  • Construction of ellipses according to de La Hire
  • Orbital plane in space, inclination, right ascension (longitude) of ascending node, Vernal equinox
• Newton’s laws of motion
• Newton’s universal law of gravitation

• Energy of satellites: Potential energy, kinetic energy, total energy
• Instantaneous speed of a satellite
• Kepler’s equation
• Satellite visibility, elevation
• Required number of LEO, MEO or GEO satellites for continuous earth coverage
• Satellite altitude and distance from a point on earth

• Choice of orbits
  • LEO, HEO, GEO
  • Elliptical orbits with non-zero inclination, Molnya orbits, Tundra orbits
  • Geosynchronous orbits
    • Parameters of geosynchronous orbits
    • Circular geosynchronous orbits
    • Inclined geosynchronous orbits
    • Quasi-zenith satellite systems (QZSS)
    • Syb-synchronous circular equatorial orbits
    • Geostationary orbit
      • Parameters of the geostationary orbit
      • Visibility
      • Propagation delay
      • Applications and system examples

• Perturbations of orbits
  • Station keeping
    • Station keeping box
    • Estimation of orbit parameters

• Fundamentals of digital communications techniques
  • Components of a digital communications system
  • Principles of encryption
  • Scrambling
  • Scrambling vs. interleaving for randomization of data sequences
  • Interleaving: Block interleaver, convolutional interleaver, random interleaver
  • Digital modulation methods
    • Linear and non-linear digital modulation methods
    • Linear digital modulation methods
      • QAM modulator and demodulator
      • Pulse shaping, square-root raised-cosine pulses
      • Average power spectral density
      • Signal space constellation
      • Examples: M-ary phase shift keying (M-PSK), M-ary quadrature amplitude shift keying (M-QAM)
      • M-PSK in noisy channels
      • Bit error probabilities of M-PSK and M-QAM
      • M-PSK vs. M-QAM
      • M-ary amplitude and phase shift keying (M-APSK)
      • M-APSK vs. M-QAM
      • Differential phase shift keying (DPSK)

Error control coding (channel coding)

• Error detecting and forward error correcting (FEC) codes
• Principle of channel coding
• Data rate, code rate, Baud rate, spectral efficiency of modulation and coding schemes
• Bandwidth-power trade-off, bandwidth-limited vs. power-limited transmission
• Coding and modulation for transparent vs. regenerative payload
• Block codes and convolutional codes
• Concatenated codes
• Bit-interleaved coded modulation
• Convolutional codes
• Low density parity check (LDPC) codes, principle of message passing decoding, bit error rate performance
• Cyclic block codes
  • Examples for cyclic block codes
  • Single errors vs. block errors, cyclic block codes for burst errors
  • Generator matrix, generator polynomials
  • Systematic encoding and syndrome determination with shift registers
  • Cyclic redundancy check (CRC) codes

• Automatic repeat request (ARQ)
  • Principle of ARQ
  • Stop-and-wait ARQ
  • Go-back-N ARQ
  • Selective-repeat ARQ
• Transmission gains and losses
  • Antenna gain
    • Antenna radiation pattern
    • Maximum antenna gain, 3dB beamwidth
    • Maximum antenna gain of circular aperture
    • Maximum antenna gain of a geostationary satellite with global coverage
  • Effective isotropic radiated power (EIRP)
  • Power flux density
  • Path loss
    • Free space loss, free space loss for geostationary satellites
    • Atmospheric loss
    • Received power
  • Losses in transmit and receive equipment
    • Feeder loss
    • Depointing loss
    • Polarization mismatch loss
  • Combined effect of losses
• Noise
  • Origins of noise
  • White noise
  • Noise power spectral density and noise power
  • Additive white Gaussian noise (AWGN) channel model
  • Antenna noise temperature
  • Earth brightness temperature
  • Signal to noise ratios
• Atmospheric distortions
  • Atmosphere of the earth: Troposphere, stratosphere, mesosphere, thermosphere, exosphere
  •  Attenuation and depolarization due to rain, fog, rain and ice clouds, sandstorms
  • Scintillation
  • Faraday effect
  • Multipath contributions
• Link budget calculations
  • GEO clear sky uplink and downlink
  • GEO uplink and downlink under rain conditions
  • Transparent vs. regenerative payload
• Link availability improvement through site diversity and adaptive transmission
  • Transparent vs. regenerative payload
    • Non-linear amplifiers
      • Saleh model, Rapp model
      • Input and output back-off factor
    • Single carrier and multicarrier operation
    • Dimensioning of transmission parameters
    • Sources of noise: Thermal noise, interference, intermodulation products
    • Signal to noise ratio and bit error probability
    • Robustness against interference and non-linear channels

• Satellite networks
  • Satellite network reference architectures
  • Network topologies
  • Network connectivity
    • Types of network connectivity
    • On-board connectivity
    • Inter-satellite links
  • Broadcast networks
  • Satellite-based internet

• Satellite communications systems and standards examples
  • The role of standards in satellite communications
  • The Digital Video Broadcast Satellite Standard: DVB-S, DVB-S2, DVB-S2X
  • Satellites in 3GPP mobile communications networks
  • LEO megaconstellations: SpaceX Starlink, Kuiper, OneWeb
  • Space debris
  • The German Heinrich Hertz mission

Students learn the entire development process for a microsystem and its application, starting with the generation of ideas, through cost planning and implementation, to the acquisition of sponsorships and the creation of an exposé.

• Introduction (Studio Technology,  Digital Transmission Systems, Storage Media, Audio Components at Home)

• Quantization (Signal Quantization, Dither, Noise Shaping, Number Representation)

• AD/DA Conversion (Methods, AD Converters, DA Converters, Audio Processing Systems, Digital Signal Processors, Digital Audio Interfaces, Single-Processor Systems, Multiprocessor Systems)

• Equalizers (Recursive Audio Filters, Nonrecursive Audio Filters, Multi-Complementary Filter Bank)

• Room Simulation (Early Reflections, Subsequent Reverberation, Approximation of Room Impulse Responses)

• Dynamic Range Control (Static Curve, Dynamic Behavior, Implementation, Realization Aspects)

• Sampling Rate Conversion (Synchronous Conversion, Asynchronous Conversion, Interpolation Methods)

• Data Compression (Lossless Data Compression, Lossy Data Compression, Psychoacoustics, ISO-MPEG1 Audio Coding)

- U. Zölzer, Digitale Audiosignalverarbeitung, 3. Aufl., B.G. Teubner, 2005.

- U. Zölzer, Digitale Audio Signal Processing, 2nd Edition, J. Wiley & Sons, 2005.

- U. Zölzer (Ed), Digital Audio Effects, 2nd Edition, J. Wiley & Sons, 2011.

• Visuelle Wahrnehmung
• Mehrdimensionale Signalverarbeitung
• Abtastung und Abtasttheorem
• Filterung
• Bildverbesserung
• Kantendetektion
• Mehrfachauflösende Verfahren: Gauss- und Laplace-Pyramide, Wavelets
• Bildkompression
• Segmentierung
• Morphologische Bildverarbeitung

Bredies/Lorenz, Mathematische Bildverarbeitung, Vieweg, 2011
Pratt, Digital Image Processing, Wiley, 2001
Bernd Jähne: Digitale Bildverarbeitung - Springer, Berlin 2005

• Transforms of discrete-time signals:

  • Discrete-time Fourier Transform (DTFT)

  • Discrete Fourier-Transform (DFT), Fast Fourier Transform (FFT)

  • Z-Transform

• Correspondence of continuous-time and discrete-time signals, sampling, sampling theorem

• Fast convolution, Overlap-Add-Method, Overlap-Save-Method

• Fundamental structures and basic types of digital filters

• Characterization of digital filters using pole-zero plots, important properties of digital filters

• Quantization effects

• Design of linear-phase filters

• Fundamentals of stochastic signal processing and adaptive filters

  • MMSE criterion

  • Wiener Filter

  • LMS- and RLS-algorithm

• Traditional and parametric methods of spectrum estimation

K.-D. Kammeyer, K. Kroschel: Digitale Signalverarbeitung. Vieweg Teubner.

V. Oppenheim, R. W. Schafer, J. R. Buck: Zeitdiskrete Signalverarbeitung. Pearson StudiumA. V.

W. Hess: Digitale Filter. Teubner.

Oppenheim, R. W. Schafer: Digital signal processing. Prentice Hall.

S. Haykin:  Adaptive flter theory.

L. B. Jackson: Digital filters and signal processing. Kluwer.

T.W. Parks, C.S. Burrus: Digital filter design. Wiley.

• Überblick über bekannte Bildgebungsverfahren
• Signalverarbeitung
• Inverse Probleme
• Computertomographie
• Magnetresonanztomographie
• Compressed Sensing
• Magnetic-Particle-Pmaging

Bildgebende Verfahren in der Medizin; O. Dössel; Springer, Berlin, 2000

Bildgebende Systeme für die medizinische Diagnostik; H. Morneburg (Hrsg.); Publicis MCD, München, 1995

Introduction to the Mathematics of Medical Imaging; C. L.Epstein; Siam, Philadelphia, 2008

Medical Image Processing, Reconstruction and Restoration; J. Jan; Taylor and Francis, Boca Raton, 2006

Principles of Magnetic Resonance Imaging; Z.-P. Liang and P. C. Lauterbur; IEEE Press, New York, 1999

• Einführung
  
• Grundlagen von VHDL
• Programmiermodelle
  
• Realisierung elementarer Datentypen
• Dynamisches Scheduling
• Sprungvorhersage
• Superskalare Maschinen
• Speicher-Hierarchien

Die Gruppenübungen vertiefen die Vorlesungsinhalte durch Bearbeiten und Besprechen von Übungsblättern und dienen somit zur Klausur-Vorbereitung. Der praktische Umgang mit Fragestellungen aus der Rechnerarchitektur wird in der FPGA-basierten PBL zur Rechnerarchitektur vermittelt, deren Teilnahme verpflichtend ist.

• D. Patterson, J. Hennessy. Rechnerorganisation und -entwurf. Elsevier, 2005.
• A. Tanenbaum, J. Goodman. Computerarchitektur. Pearson, 2001.
  

Auf dem Gebiet der Informatik haben wir nur eingeschränkte Möglichkeiten auf die Effizienz der Hardware direkt einzuwirken, bzw. sind abhängig von den Herstellern (bspw. von Mikrocontrollern). Um jedoch das volle Potential der uns gestellten Hardware auf Systemebene auszunutzen, benötigen wir ein tiefergehendes Verständnis über die Hintergründe, Prozesse und Mechanismen von Verlustleistungen in eingebetteten Systemen. Woher kommt die Verlustleistung, was passiert auf Hardware-Ebene, welche Mechanismen kann ich direkt/indirekt nutzen, welchen Tradeoff zwischen Flexibilität und Effizienz habe ich,... sind nur einige Fragen, welche in dieser Veranstaltung erarbeitet und diskutiert werden sollen.

• Motivation und Verlustleistung von Halbleitern
• Verlustleistung digitaler Schaltungen, insbesondere CMOS
• Power Management in Hard- und Software (Sleep Modes, DVS, FS, Undervolting)
• Energieeffizientes Systemdesign (Anwendungen)
• Energy Harvesting und Transiently Powered Computing (TPC)

DE: Die Vorlesung basiert af einer Vielzahl von Quellen, welche in [1.] angegeben sind.

ENG: The lecture is based on multiple sources which are listed in [1.].

1. Kulau, Ulf: Course: Energy Efficiency in Embedded Systems-A System-Level Perspective for Computer Scientists, EWME, 2018.
2. Harris, David, and N. Weste: CMOS VLSI Design ed., Pearson Education, 2010
3. Rabaey, Jan: Low Power Design Essentials (Integrated Circuits and Systems), Springer, 2009

In dieser Projektbasierten Übung werden die erlernten Aspekte zur Erreichung von energieffizienten eingebetten Systemen in praxisnahen Umgebungen in einem kleinen Projekt imlementiert und gefestigt. Dabei wird zunächst durch definietre Aufgaben ein Tool-Set für die Implementierung von Energieeffizienzmechanismen in gemeinsamen Übungen implementiert. Im zweitenTeil erfolgt eine Challenge-Based Übung, bei der ein möglichst effizientes System eigenständig implementiert werden soll. Zur Anwendung kommt ein System basierend auf einem AVR Mikro-Controller, welcher durch einen Solar-Energy Harvester autonom betrieben werden kann.

1. Aufgabenphase: 6 "hands-on" Aufgaben um Erfahrungen zu ammeln und eine SW Bibliothek zu erstellen
2. Projekphase: Implementierung eines Energieautonomen Systems mit dem Ziel größtmögliche Energieefizienz (Challenge)
   

In der Hörsaalübung werden die in der Vorlesung gelehrten theoertischen Grundlagen vertieft. Dies geschiet durch vertiefende Diskussion relevanter Asekte, aber auch durch Rechenbeispiele, bei denen ein tiefergehendes verständnis zu der thematik der Energieefizienz in eingebeteten Systemen eröangt wird. Übungsaufgaben werden im Vorfeld verteilt und Lösungen in der Hörsaalübung vorgestellt. Inhalte der Übung sind wie folgt:

• Grundlagen und Berechnung von verlustleistung auf Halbleitern
• Verlustleistung von CMOS am Beispiel eines Inverters
• Einfluss des Aktivitätsfaktors und externer Komponenten
• DVS und Scheduling
• Evaluation zur Darstellung des Nutzen von Undervolting
• Aspekte des Energy-Harvesting (MPPT)
  

• General-Purpose Processors
• Programming the Atmel AVR
• Interrupts
• C für Embedded Systems
• Standard Single Purpose Processors: Peripherals
• Finite-State Machines
• Speicher
• Betriebssystem für Eingebettete Systeme
• Echtzeit Eingebettete Systeme
  

1. Embedded System Design,  F. Vahid and T. Givargis,  John Wiley

2. Programming Embedded Systems: With C and Gnu Development Tools, M. Barr and A. Massa, O'Reilly

3. C und C++ für Embedded Systems,  F. Bollow, M. Homann, K. Köhn,  MITP
   

4. The Art of Designing  Embedded Systems, J. Ganssle, Newnses

5. Mikrocomputertechnik mit Controllern der Atmel AVR-RISC-Familie,  G. Schmitt, Oldenbourg
   

6. Making Embedded Systems: Design Patterns for Great Software, E. White, O'Reilly

Beschreibung

• Zuverlässigkeit
• Verfügbarkeit
• Wartbarkeit
• Sicherheit - Safety & Security

Inhalt

• Modellierung
• Fehlertoleranz
• Entwurfskonzepte
• Analyse von Systemen

Inhalte:

• Physikalische Messgrößen und Sensorik
• Processing Units (MCUs, FPGAs, DSPs, HW-Accelerator)
• Low-Power Processing, Fehlertoleranzmechanismen (in Bezug auf Sensoren)
• Integrierte digitale Signalverarbeitung (Aggregation, Filter, Vorverarbeitung, Feature Detection)
• Erweiterte integrierte Signalverarbeitung (Sensor Fusion, embedded AI)
• Anwendungen und Trends in Smart Sensors

• Kennenlernen einer ULP FPGA Plattform und anschließende...
  
• Begleitende Praktische Übung (Implementierung eines Sensorsystems mit integrierter Signalverarbeitung)
• Freie Aufgabe
  

Students learn the entire development process for a microsystem and its application, starting with the generation of ideas, through cost planning and implementation, to the acquisition of sponsorships and the creation of an exposé.

• Introduction
• Specifications and Modeling
• Embedded/Cyber-Physical Systems Hardware
• System Software
• Evaluation and Validation
• Mapping of Applications to Execution Platforms
• Optimization
  

• Peter Marwedel. Embedded System Design - Embedded Systems Foundations of Cyber-Physical Systems. 2^nd Edition, Springer, 2012., Springer, 2012.
  

• Introduction
• Specifications and Modeling
• Embedded/Cyber-Physical Systems Hardware
• System Software
• Evaluation and Validation
• Mapping of Applications to Execution Platforms
• Optimization

• Peter Marwedel. Embedded System Design - Embedded Systems Foundations of Cyber-Physical Systems. 2^nd Edition, Springer, 2012., Springer, 2012.

Brief outline:

• Parallel computers and their classification
• Centralized and distributed shared-memory architectures: snooping vs directory-based cache coherence protocols, implementation, and limitations
• Chip multiprocessors: software-based, block (coarse-grain), interleaved (fine-grain), simultaneous multithreading
• Synchronization: high-level primitives and implementation, memory consistency models: sequential and weaker memory consistency models
• Interconnection networks: topologies (direct and indirect networks) and routing techniques
• Graphics Processing Units (GPUs) architecture and programming using CUDA/OpenCL
• Parallel programming with message passing interface (MPI), OpenMP
  

• Michel Dubois, Murali Annavaram, and Per Stenström, Parallel Computer Organization and Design (Book)
• David A Patterson and John L. Hennessy, Computer Architecture: A Quantitative Approach, Elsevier (Book)
• David B. Kirk, Wen-mei W. Hwu, Programming Massivley Parallel Processors, Elsevier (Book)

There will be 3-4 assignments for project-based learning consisting of the following: 

• Implement and compare different cache coherence protocols using a simulator or a high-level, event-driven simulation interface such as SystemC
• Programming massively parallel systems to solve computationally intensive problems such as password cracking using CUDA/OpenCL/MPI/OpenMP

The following literature will be useful for project-based learning. The further required resources will be discussed during the course.

• David B. Kirk, Wen-mei W. Hwu, Programming Massivley Parallel Processors, Elsevier (Book)
• MPI Forum, https://www.mpi-forum.org/ 
• SystemC, https://www.accellera.org/community/systemc
  

- Review of computer architecture basics - measuring performance, benchmarks, five-stage RISC pipeline, caches
- GPU basics - evolution of GPU computing, a high-level overview of a GPU architecture
- GPU programming with CUDA - program structure, CUDA threads organization, warp/thread-block scheduling
- GPU (micro) architecture - streaming multiprocessors, single instruction multiple threads (SIMT) core design, tensor/RT cores, mixed-precision support
- GPU memory hierarchy - banked register file and operand collectors, shared memory, GPU caches (differences w.r.t. CPU caches), global memory
- Branch and memory divergence - branch handling, stack-based reconvergence, memory coalescing, coalescer design
- Barriers and synchronization
- Temporal and spatial locality exploitation challenges in GPU caches
- Global memory- high throughput requirements, GDDR/HBM, memory bandwidth optimization techniques
- GPU research issues - performance bottlenecks, GPU power modeling, high-power consumption/energy efficiency, GPU security
- Application case study - deep learning
- Cycle-accurate simulators for GPUs

The learning in the lectures will be augmented by a semester-long problem-based project.

• David B. Kirk, Wen-mei W. Hwu, Programming Massively Parallel Processors - A Hands-on Approach, Second Edition (Book)
• David A. Patterson and John L. Hennessy, Computer Architecture: A Quantitative Approach, 5th Edition (Book)

A semester-long problem-based project will augment the learning in the lectures. Several topics related to GPUs will be proposed. You are required to choose a topic and work on it. It is possible to work in groups. There will be (bi-) weekly meetings to discuss progress and problems. 

In addition to the semester-long project, there will be assignments to teach CUDA programming. 

• David B. Kirk, Wen-mei W. Hwu, Programming Massively Parallel Processors - A Hands-on Approach, Second Edition (Book)
• David A. Patterson and John L. Hennessy, Computer Architecture: A Quantitative Approach, 5th Edition (Book)

• Introduction (historical view and trends in der Silicon Photonics)
• Fabrication Technology (SOI-Wafer, Deposition, Sputtering and Evaporation, Epitaxy, MOCVD, Lithography)
• Planar Waveguide Fundamentals
• Optical Materials in silicon Photonics
  
• Waveguide Types (Loss Mechanisms, Dispersion and Polarisation in Waveguides)
• Coupling of Silicon Photonic Devices and Systems
• Silicon Photonic Circuit Devices and Building Blocks (Passive Devices: Resonators, Interferometers, Mode Converters, Power Splitters,  Gratings, Polarizers and Rotators)
• Material fundamentals and components for tuning and switching
• Integration of active Devices (Laser, Detector, Modulators)
• Photonics and Electronics Integration
• Photonic Interconnects
• Optical Multiplexing
  
• Switch Fabrics and Routers
• Silicon Photonics for Sensing

• Graham T. Reed, Andrew Knights, Silicon Photonics - An Introduction, John Wiley & Sons Ltd (2004)
• Clifford R. Pollocka and Michal Lipson, Integrated Photonics, Springer-Verlag (2003)
• Sami Franssila, Introduction to microfabrication,  Chichester, West Sussex Wiley (2010)
• Dominik G. Rabus, Integrated Ring Resonators: The Compendium,  in Springer Series in Optical Sciences (2007)  
  

• Einführung in die Elektromagnetische Verträglichkeit (EMV)
  
• Störquellen in Zeit- und Frequenzbereich
• Kopplungsmechanismen
• Leitungen und ihre Kopplung an elektromagnetische Felder
• Schirmung
• Filter
• EMV-Prüfverfahren
  

• C.R. Paul: "Introduction to Electromagnetic Compatibility", 2nd ed., (Wiley, New Jersey, 2006).
• A.J. Schwab und W. Kürner: "Elektromagnetische Verträglichkeit", 6. Auflage, (Springer, Berlin 2010).
• F.M. Tesche, M.V. Ianoz, and T. Karlsson: "EMC Analysis Methods and Computational Models", (Wiley, New York, 1997).
  

Die Übung dient der Vertiefung und Einübung der Vorlesungsinhalte.

• C.R. Paul: "Introduction to Electromagnetic Compatibility", 2nd ed., (Wiley, New Jersey, 2006).
• A.J. Schwab und W. Kürner: "Elektromagnetische Verträglichkeit", 6. Auflage, (Springer, Berlin 2010).
• F.M. Tesche, M.V. Ianoz, and T. Karlsson: "EMC Analysis Methods and Computational Models", (Wiley, New York, 1997).
• Scientific articles and papers
  

Mit Hilfe von Laborversuchen werden die folgenden Themenfelder der EMV praktisch untersucht:

• Schirmung
• Leitungsgeführte EMV-Prüfverfahren
• Die GTEM-Zelle als feldgebundene Prüfumgebung
  

• Definition of specifications
• Architecture studies
• Digital simulation flow
• Philosophy of standard cells
• Placement and routing of standard cells
• Layout generation
• Design checking routines

• Theory of optical waveguides
• Coupling to and from waveguides
• Losses
• Linear and nonlinear dspersion
• Components and technical applications

Bahaa E. A. Saleh, Malvin Carl Teich, Fundamentals of Photonics, Wiley 2007
Hunsperger, R.G., Integrated Optics: Theory and Technology, Springer, 2002
Agrawal, G.P.,Fiber-Optic Communication Systems, Wiley, 2002, ISBN 0471215716
Marcuse, D., Theory of Dielectric Optical Waveguides, Academic Press,1991, ISBN 0124709516
Tamir, T. (ed), Guided-Wave Optoelectronics, Springer, 1990

See lecture Fibre and Integrated Optics

See lecture Fibre and Integrated Optics

• Introduction to optics
• Electromagnetic theory of light
• Interference
• Coherence
• Diffraction
• Fourier optics
• Polarisation and Crystal optics
• Matrix formalism
• Reflection and transmission
• Complex refractive index
• Dispersion
• Modulation and switching of light

Bahaa E. A. Saleh, Malvin Carl Teich, Fundamentals of Photonics, Wiley 2007 
Hecht, E., Optics, Benjamin Cummings, 2001
Goodman, J.W. Statistical Optics, Wiley, 2000
Lauterborn, W., Kurz, T., Coherent Optics: Fundamentals and Applications, Springer, 2002

see lecture Optoelectronics 1 - Wave Optics

Students learn the entire development process for a microsystem and its application, starting with the generation of ideas, through cost planning and implementation, to the acquisition of sponsorships and the creation of an exposé.

- Die Rolle von Packages und Interconnects in elektronischen Systemen

- Komponenten der Aufbau- und Verbindungstechnik elektronischer Systeme

- Hauptziele und Konzepte der Signal- und Powerintegrität elektronischer Systeme

- Wiederholung relevanter Konzepte der elektromagnetischen Feldtheorie

- Eigenschaften digitaler Signale und Systeme

- Entwurf und Charakterisierung der Signalintegrität

- Entwurf und Charakterisierung der Spannungsversorgung

- Techniken und Geräte zur Messung in Zeit- und Frequenzbereich

- CAD-Werkzeuge für elektrische Analyse und Entwurf von Packages und Interconnects

- Bezug zur gesamten elektromagnetischen Verträglichkeit von elektronischen Systemen

- J. Franz, "EMV: Störungssicherer Aufbau elektronischer Schaltungen", Springer (2012)

- R. Tummala, "Fundamentals of Microsystems Packaging", McGraw-Hill (2001)

- S. Ramo, J. Whinnery, T. Van Duzer, "Fields and Waves in Communication Electronics", Wiley (1994)

- S. Thierauf, "Understanding Signal Integrity", Artech House (2010)

- M. Swaminathan, A. Engin, "Power Integrity Modeling and Design for Semiconductors and Systems", Prentice-Hall (2007)